Texture and residual macrostress of Ti-N coatingsGOKHMAN, A.Thin solid films. 1993, Vol 228, Num 1-2, pp 229-232, issn 0040-6090Conference Paper

Calculations for defects formed on diamond surfacesHALICIOGLU, T.Thin solid films. 1993, Vol 228, Num 1-2, pp 293-296, issn 0040-6090Conference Paper

In and ex situ diagnostics of the growth of α-Ti thin films deposited by plasma-enhanced physical vapour depositionSTEFFEN, H; WULFF, H; LUNK, A et al.Thin solid films. 1993, Vol 228, Num 1-2, pp 117-120, issn 0040-6090Conference Paper

Initial growth mechanism of Bi-Sr-Ca-Cu-O thin films on SrTiO₃(110) surfaces studied by in-situ reflection high energy electron diffraction observationMIURA, T; ISHIZUKA, Y.Thin solid films. 1993, Vol 228, Num 1-2, pp 189-192, issn 0040-6090Conference Paper

MoS_2-x lubricating films : structure and wear mechanisms investigated by cross-sectional transmission electron microscopyMOSER, J; LEVY, F.Thin solid films. 1993, Vol 228, Num 1-2, pp 257-260, issn 0040-6090Conference Paper

Preparation and structure of Cu-W thin filmsRADIC, N; GRZETA, B; GRACIN, D et al.Thin solid films. 1993, Vol 228, Num 1-2, pp 225-228, issn 0040-6090Conference Paper

The effect of surface aluminum oxide films on thermally induced hillock formationCHANG, C. Y; VOOK, R. W.Thin solid films. 1993, Vol 228, Num 1-2, pp 205-209, issn 0040-6090Conference Paper

The oxidation kinetics of thin copper films studied by ellipsometryRAUH, M; WISSMANN, P.Thin solid films. 1993, Vol 228, Num 1-2, pp 121-124, issn 0040-6090Conference Paper

Effects of carbon impurities in high Tic superconducting tapes using Auger electron spectroscopySEIBT, E. W; JEREMIE, A; FLÜKIGER, R et al.Thin solid films. 1993, Vol 228, Num 1-2, pp 196-200, issn 0040-6090Conference Paper

In-situ growth of epitaxial YBa₂Cu₃O₇ thin films by on-axis unbalanced d.c. magnetron sputteringSAVVIDES, N; KATSAROS, A.Thin solid films. 1993, Vol 228, Num 1-2, pp 182-185, issn 0040-6090Conference Paper

Preparation and microstructure of reactively sputtered Ti_1-xZr_xN filmsSAKAMOTO, I; MARUNO, S; JIN, P et al.Thin solid films. 1993, Vol 228, Num 1-2, pp 169-172, issn 0040-6090Conference Paper

Reactivity between Ti and N₂-C₂H₂ mixed gas on Ti(C,N) film deposition by arc-like plasma-enhanced ion platingKAJIOKA, H; HIGUCHI, K; KAWASHIMO, Y et al.Thin solid films. 1993, Vol 228, Num 1-2, pp 280-284, issn 0040-6090Conference Paper

Reflection electron microscopy study of thin film growthYAGI, K; MINODA, H; SHIMA, M et al.Thin solid films. 1993, Vol 228, Num 1-2, pp 12-17, issn 0040-6090Conference Paper

X-ray photoelectron spectroscopy and secondary-ion mass spectrometry of boron nitride thin films on austenitic stainless steelINGO, G. M; PADELETTI, G.Thin solid films. 1993, Vol 228, Num 1-2, pp 276-279, issn 0040-6090Conference Paper

ECOSS-17 European Conference on Surface ScienceHABRAKEN, Frans; KLEIJN, Aart; VAN SILFHOUT, Arend et al.Surface science. 1998, Vol 402-04, issn 0039-6028, 945 p.Conference Proceedings

Area-selective CVD of metalsTSUBOUCHI, K; MASU, K.Thin solid films. 1993, Vol 228, Num 1-2, pp 312-318, issn 0040-6090Conference Paper

Computer simulation of growth of thin films fabricated by the sputtering method : comparison with experimentNANBU, K; UCHIDA, S; YOSHIDA, H et al.Thin solid films. 1993, Vol 228, Num 1-2, pp 330-332, issn 0040-6090Conference Paper

Effect on lacquer adhesion of solid state properties of tin oxidesINGO, G. M; SCAVIA, G; GIORGI, L et al.Thin solid films. 1993, Vol 228, Num 1-2, pp 218-221, issn 0040-6090Conference Paper

Morphology of thin polyimide filmsDANEV, G; SPASSOVA, E; POPOVA, K et al.Thin solid films. 1993, Vol 228, Num 1-2, pp 301-303, issn 0040-6090Conference Paper

On the influence of the substrate properties on the internal growth stress of titanium films at 250°CSCHNEEWEISS, H. J; ABERMANN, R.Thin solid films. 1993, Vol 228, Num 1-2, pp 40-43, issn 0040-6090Conference Paper

Properties and applications of vacuum-deposited Cu-Cr filmsSCHUMANN, J; BRÜCKNER, W; HEINRICH, A et al.Thin solid films. 1993, Vol 228, Num 1-2, pp 44-48, issn 0040-6090Conference Paper

Relation between the dislocations in chemically vapour-deposited diamond and the linewidth of the Raman spectrumMITSUHASHI, M; KARASAWA, S; OHYA, S et al.Thin solid films. 1993, Vol 228, Num 1-2, pp 76-79, issn 0040-6090Conference Paper

Thin films in the integrated circuit industry : requirements and deposition methodsGRANNEMAN, E. H. A.Thin solid films. 1993, Vol 228, Num 1-2, pp 1-11, issn 0040-6090Conference Paper

Characterization of a sputtered amorphous W-C-Co coating annealed in airCAVALEIRO, A; VIEIRA, M. T.Thin solid films. 1993, Vol 228, Num 1-2, pp 80-86, issn 0040-6090Conference Paper

High dose implantation of nitrogen in tool steel : Auger electron spectroscopy and hardness measurementsBREDELL, L. J; MALHERBE, J. B.Thin solid films. 1993, Vol 228, Num 1-2, pp 267-271, issn 0040-6090Conference Paper